Silicon technology
|
Isotropical- und anisotropical
silicon etch techniques enable the three dimensional structuring
of silicon.
|
|
Vertical ditches
and walls in silicon
|
|
|
|
By
anisotropical deep reactive etching of silicon any structures
with dimensions even below 1 µm with vertical side walls can
be generated. That is how aspect ratios for ditches of up
to 5 and such for walls bigger than 10 can be reached.
|
|
Multistep
structures with vias
|
|
|
|
The 3D-silicontechnology makes it possible to realize multistep
structures and others with vias. The ultimate hight can be
about 1 mm.
|
|
Isotropical
etched structures
|
|
|
|
Apart from the structures with the vertical walls we can also
fabricate them with concave walls which can be applied to
microfluidic structures.
|
|
|