MEMS Technology
To implement your ideas we have a wide range of micro fabrication processes and technologies available. To offer one source we have selected partners for services we do not have in house.
Thin film deposition
To be able to generate functional or masking films we have a variety of processes and materials available. We are able to deposit lots of metals, oxides and other materials. Film thicknesses can be varied from a few nanometer up to a few 100 micrometer. It is possible to deposit on materials like glass, silicon, plastic and others.
Micro structuring
To generate functional components we have structuring processes like wet chemical and dry chemical etching. With these we are able to pattern metallic films, silicon or silicon dioxide. Film thicknesses can start from a few nanometer up to some micrometer. Furthermore we can also etch completely through silicon substrates.
Photolithography
The basis for every micro processing is photo lithography. Photo lithography defines the design that is applied on or into the substrate by subsequent processes. Depending on the following process we have different kinds of photo lithography to use. For minimum feature sizes of 400nm we use thin photo resist processes. Lift-off processes are used for non-etchable materials like noble metals. Thick photo resists are used for electroplating.
Back end processes
Following micro structuring, precision dicing is used to separate micro components from the substrate. By the use of anodic bonding we can encapsulate MEMS parts, by wire bonding we add interconnections from MEMS parts to circuit boards for instance.
Micro analysis
To analyze the MEMS parts and films we fabricated we have analysis methods like electron microscopy, scanning probe microscopy, ellipsometry, thin film measurement and others available.